
Shengao Electronic Material Slitting Blades: Engineered for ultra-precision, contamination-free cutting in cleanroom environments. Ideal for lithium-ion battery electrodes, flexible circuit boards, thin-film solar cells, and semiconductor components.
√ Medical-grade stainless steel & ceramic composites for clean cutting
√ Nanometer-level precision for burr-free edges and minimal waste
√ Advanced non-stick coatings (DLC, TiN) prevent adhesion and ease cleaning
√ Custom sizes and specs for cleanroom and CCD vision systems
Electronic material slitting blades are ultra-precision cutting tools engineered for contamination-free processing of delicate components in critical high-tech applications. Our high-performance blades are manufactured using medical-grade materials and advanced nano-coating technologies to ensure exceptional accuracy, minimal kerf loss, and superior surface finish.
Used in applications including lithium-ion battery electrode processing, flexible circuit board fabrication, thin-film solar cell segmentation, semiconductor component dicing, and optical display manufacturing, our electronic slitting blades provide the cutting precision and reliability needed for optimal production efficiency in cleanroom environments. We offer customized solutions tailored to specific material characteristics, tolerance requirements, and automated production line specifications.
At Shengao, we specialize in manufacturing ultra-precision electronic material slitting blades engineered for contamination-free performance in critical cleanroom environments and high-tech applications. Our custom blade service offers medical-grade materials including stainless steel (304/430/420/440 grades), ceramic composites, and specialized coatings with advanced treatments such as cryogenic processing, laser hardening.
Our electronic slitting blades are designed for optimal performance in sensitive applications including lithium-ion battery electrode processing, flexible circuit board fabrication, thin-film solar cell segmentation, and semiconductor component dicing. With strict quality control throughout our manufacturing process - from design and material selection to CNC machining, precision grinding, and surface finishing.
Shengao Electronic Material Slitting Blades: Engineered for ultra-precision, contamination-free performance in critical high-tech manufacturing and cleanroom environments. Key advantages include:
Material Versatility: Specialized tungsten carbide and ceramic coatings for precision cutting of lithium-ion battery electrodes, flexible circuit boards, thin-film solar cells, and semiconductor components with minimal kerf loss.
Nanometer-Level Precision: CNC grinding ensures consistent edge geometry for burr-free cuts and extended service life in high-speed operations.
Custom Solutions: Tailored designs with specific edge angles, coatings, and hardness (HRC 58-65) for unique cleanroom and production line requirements.
Advanced Surface Treatments: Non-stick coatings (DLC, TiN, TiCN) reduce friction, prevent adhesion, resist corrosion, and facilitate easy cleaning.
Cleanroom Compatibility: Medical-grade materials and polished surfaces prevent contamination, meeting stringent hygiene standards for electronic and medical device manufacturing.
Shengao electronic material slitting blades are engineered with superior features to deliver contamination-free performance, exceptional accuracy, and extended tool life in high-precision cutting applications for sensitive electronic components and cleanroom environments.
These advanced features make Shengao electronic material slitting blades the preferred choice for professionals seeking reliability, exceptional accuracy, and superior value in high-precision cutting operations across global electronic manufacturing industries.
Find answers to common questions about our ultra-precision electronic material slitting blades for delicate components and cleanroom applications
Shengao electronic material slitting blades are crafted from premium materials to ensure contamination-free performance and exceptional accuracy in cleanroom environments:
Each material undergoes specialized heat treatment and cryogenic processing to achieve optimal hardness (HRC 58-65) while maintaining toughness for delicate electronic component processing .
Selecting the appropriate electronic material slitting blade depends on several critical factors for high-precision applications:
Our technical team provides customized recommendations based on your specific cleanroom requirements, material characteristics, and machine specifications for precision electronic manufacturing .
Proper maintenance extends blade life and ensures consistent high-precision performance in electronic material processing:
Shengao offers specialized blade sharpening services and provides detailed cleanroom maintenance protocols with every purchase to maximize your investment in precision electronic manufacturing .
Yes, we specialize in custom electronic material slitting blade solutions for specialized high-tech applications:
Our engineering team can develop and validate custom electronic slitting blade solutions within 10-15 working days. Minimum order quantities start at just 5 units for custom blade designs, with volume discounts available for production-scale orders .
Our electronic material slitting blades serve diverse high-tech applications requiring ultra-precision and contamination control:
We also serve the aerospace, automotive electronics, and advanced packaging industries with specialized cleanroom cutting solutions for sensitive electronic components .